Aircraft digital assembly process design technology based on 3D Model
نویسندگان
چکیده
منابع مشابه
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15 صفحه اول3D Packaging Architectures and Assembly Process Design
2D Two dimensional 3D Three dimensional BEOL Back end of line BI Burn-In CMP Chemical mechanical polishing D2D Die-to-die D2W Die-to-wafer ECD Electro-chemical deposition ECG Deleted in chapter EMIB Embedded multi-die interconnect bridge FEOL Front end of line IP Intellectual property KGD Known good die KOZ Keep out zone MCM Multi chip module MCP Multi chip package MEOL Middle end of line MPM M...
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ژورنال
عنوان ژورنال: MATEC Web of Conferences
سال: 2018
ISSN: 2261-236X
DOI: 10.1051/matecconf/201820202004